Bay 3 - Dry processing

Touch-screen computer controlled R&D level thin film deposition system fitted with KJLC Torus® magnetron sputter sources driven by DC and RF power supplies. This system has a large volume HV chamber and can incorporate substrates upto 4" in diameter. Additional substrate holders are available for smaller sample sizes. Currently being used for Au, Ag, SiO2, ITO, Al, TiO2 & Al2O3, the system can easily be used to deposit a variety of non-hazardous materials. Feature's include simultaneous material deposition, controlled process gas integration and substrate heating.

Touch-screen fully computer controlled R&D level thin film deposition system fitted with a four pocket electron beam source. Currently used to deposit Au, Ti, Al, and SiO2, the system can be used with samples up to 9" in diameter. Deposition is computer controlled using quartz crystal monitoring to ensure accurate thickness and rate of deposition.

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